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Strain-measurement methods as a forecasting factor for the behavior of semiconductor thermoelements under extreme temperatures

Abstract

Strain effects, arising owing to shear stresses in a thermoelement with low branches, are studied.

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Literature cited

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Additional information

Translated from Inzhenerno-Fizicheskii Zhurnal, Vol. 53, No. 1, pp. 52–55, July, 1987.

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Iordanishvili, E.K., Olimov, K.O. & Ravich, Y.I. Strain-measurement methods as a forecasting factor for the behavior of semiconductor thermoelements under extreme temperatures. Journal of Engineering Physics 53, 780–782 (1987). https://doi.org/10.1007/BF00874036

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Keywords

  • Shear Stress
  • Statistical Physic
  • Extreme Temperature
  • Strain Effect
  • Forecast Factor