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Journal of Materials Science

, Volume 31, Issue 10, pp 2523–2529 | Cite as

Effect of thermal residual stress on the crack path in adhesively bonded joints

  • H. R. Daghyani
  • L. Ye
  • Y. -W. Mai
Papers

Abstract

Mode I fracture behaviour of adhesively bonded double and cantilever beam (DCB) compact tension (CT) joints was studied using a rubber-modified epoxy (Araldite® GY260) as the adhesive. Adherends were prepared from a carbon fibre (CF)/epoxy composite or aluminium alloys. The crack path in the joints was studied based on the sign of the non-singularT-stress ahead of the crack tip by calculating the thermal residual stress in the joints using finite element analysis. The results indicate that the type of adherend materials influence the level of the thermal residual stress in the adhesive layer, which consequently causes different crack paths in the joints, i.e. a uniformly smooth fracture surface in both CT and DCB aluminium joints and a wavy crack growth in the DCB CF/epoxy composite joints. However, the fracture energies of different types of adhesive joints were almost identical to each other for bond thicknesst<0.2 mm, and a somewhat higher fracture resistance was obtained for the CF/epoxy DCB joints with large bond thickness.

Keywords

Aluminium Alloy Cantilever Beam Crack Path Adhesive Layer Fracture Resistance 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Chapman & Hall 1996

Authors and Affiliations

  • H. R. Daghyani
    • 1
  • L. Ye
    • 1
  • Y. -W. Mai
    • 1
  1. 1.Centre for Advanced Materials Technology (CAMT), Department of Mechanical and Mechatronic EngineeringThe University of SydneyAustralia

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