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Thermal resistance between liquid3He and copper potassium tutton salt

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Abstract

The thermal resistance between liquid3He and copper potassium tutton salt (CPS) has been measured through its magnetic ordering temperature (T c=29.6 mK). The thermal resistanceR for pure3He has a broad minimum near 60 mK and increases continuously throughT cwith decreasing temperature, except for a dip atT c. BelowT c,R is proportional toT −1.5. Effects of4He coating have been studied by stepwise addition of4He into liquid3He. The thermal resistance increased drastically for the liquid containing 150 ppm4He and more for 95%4He. By sudden depressurization of the liquid3He containing 480 ppm4He, a considerable decrease ofR was observed. SinceR for pure3He was much smaller than the calculated Kapitza resistance, the present experimental results indicate the existence of surface magnetic coupling between liquid3He and CPS.

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Fujii, Y., Shigi, T. Thermal resistance between liquid3He and copper potassium tutton salt. J Low Temp Phys 66, 69–84 (1987). https://doi.org/10.1007/BF00681468

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Keywords

  • Copper
  • Potassium
  • Depressurization
  • Magnetic Material
  • Thermal Resistance