Journal of Materials Science

, Volume 28, Issue 7, pp 1765–1774 | Cite as

Effects of the relative contents of silver and copper on the interfacial reactions and bond strength in the active brazing of SiC

  • Hyoung-Keun Lee
  • Sun-Hyo Hwang
  • Jai-Young Lee


The roles of titanium in active brazing of SiC have been studied extensively, while studies on the roles of silver and copper, which constitute the major parts of the active brazing alloys, have been overlooked. The effects of the relative contents of silver and copper in the brazing alloy on the interfacial reactions and bond strength have been investigated in this study. The interfacial reactions can be divided into the decomposition reaction of SiC by the brazing alloy melt and the interfacial reaction of titanium with SiC. Brazing by the Cu-5at% Ti alloy induced SiC to be decomposed, but the addition of silver to the brazing alloy suppressed the decomposition of SiC. TiC and Ti5Si3 was produced from the interfacial reactions of titanium independent of the brazing alloys. However, their morphologies and formation mechanisms differ greatly depending on the relative contents of silver and copper. The bond strength and fracture modes are also dependent on the relative contents of silver and copper. A good bond strength of 159–178 MPa was obtained by brazing with the Ag-5at% Ti alloy at 985°C for 600 s and fracture initiates at the interface of the reaction product layer and propagates through SiC.


Polymer Copper Titanium Bond Strength Major Part 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    T. Okuo, Y. Kusaka andY. Aiyama,J. High Temp. Soc. 11 (1985) 186 (in Japanese).Google Scholar
  2. 2.
    T. W. Eagar,Weld. J. 66 (1987) 35.Google Scholar
  3. 3.
    H. Mizuhara andE. Huebel,ibid. 65 (1986) 43.Google Scholar
  4. 4.
    J. K. Boadi, T. Yano andT. Iseki,J. Mater. Sci. 22 (1987) 2431.CrossRefGoogle Scholar
  5. 5.
    T. Yano, H. Suematsu andT. Iseki,ibid. 23 (1988) 3362.CrossRefGoogle Scholar
  6. 6.
    H. Sakao andJ. F. Elliott,Metall. Trans. 5 (1974) 2036.CrossRefGoogle Scholar
  7. 7.
    O. Kubaschewski andC. B. Alcock, “Metallurgical Thermochemistry” (Pergamon Press, Oxford, 1979).Google Scholar
  8. 8.
    G. G. Gnesin andYu. V. Naidich,Sov. Powder Met. Metal Ceram. 74 (1969) 128.CrossRefGoogle Scholar
  9. 9.
    V. N. Eremenko, Yu. I. Buyanov andN. M. Panchenko,ibid. 89 (1970) 410.Google Scholar
  10. 10.
    J. A. Pask,Amer. Ceram. Soc. Bull. 66 (1987) 1587.Google Scholar
  11. 11.
    D. A. Mortimer andM. Nicholas,J. Mater. Sci. 8 (1973) 640.CrossRefGoogle Scholar
  12. 12.
    T. Iseki, T. Yano andY. S. Chung,Jpn Ceram. Soc. Bull. 97 (1989) 710 (in Japanese).CrossRefGoogle Scholar
  13. 13.
    A. J. Moorhead andH. Keating,Weld. J. 65 (1986) 17.Google Scholar
  14. 14.
    H. K. Lee andJ. Y. Lee,J. Mater. Sci. Lett. 11 (1992) 550.CrossRefGoogle Scholar
  15. 15.
    M. Backhaus-Ricoult, in “Proceedings of the International Workshop on Bonding, Structure, and Mechanical Properties of Metal/Ceramic Interfaces”, Santa Barbara, January 1989, edited by M. Rühle, A. G. Evans, M. F. Ashby, J. P. Hirth (Pergamon Press, Oxford, 1990) p. 79.Google Scholar

Copyright information

© Chapman & Hall 1993

Authors and Affiliations

  • Hyoung-Keun Lee
    • 1
  • Sun-Hyo Hwang
    • 1
  • Jai-Young Lee
    • 1
  1. 1.Korea Advanced Institute of Science and TechnologyCheongyang, SeoulKorea

Personalised recommendations