High temperature creep behaviour of an Ni-Cr-W-B alloy
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The high-temperature creep behaviour of a solid-solution strengthened Ni-Cr-W-B alloy was studied, with emphasis on microstructural parameters. Creep strength was determined from tests conducted at 925°C/40 MPa. Various techniques of analytical electron microscopy were used to characterize the microstructure and microchemical composition. A number of microstructural parameters which promote creep strength, including (1) pinning of grain boundaries by tungsten-rich M6C carbide, (2) relatively low stacking-fault energy, and (3) boron segregation to M23C6 carbide, were identified. However, their beneficial effects were suppressed by the initial presence of discontinuously precipitated M23C6 carbide at grain boundaries which accelerated intergranular cracking. Suppression of the discontinuous grainboundary reaction and a significant improvement in creep strength could be achieved by a proper heat treatment which appeared to induce a sufficiently high defect density promoting intragranular carbide precipitation. Competition between intergranular and intragranular precipitation was found to be influenced by an external stress. Strengthening by intragranular carbide precipitates appeared to occur by an attractive interaction with dislocations. Dislocations bowing out at subboundaries, cross-slip, motion of jogged screw dislocations and generation of dislocations at high-angle grain boundaries appeared to operate simultaneously as strain-producing mechanisms during steady-state creep.
KeywordsCreep Behaviour Creep Strength Microstructural Parameter Intergranular Crack M23C6 Carbide
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