Microstructural changes of polycrystalline nickel during high-temperature deformation at ambient and high pressures
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The microstructures of polycrystalline nickel, deformed in compression at temperatures of 1000–1500 K at high pressure (1500 MPa) and at ambient (0.1 MPa) pressure, were compared. Dynamic recrystallization and strain-induced grain growth were observed to occur during creep tests at both pressure levels. Our experimental results at ambient pressure are in good agreement with Sandstrom and Lagneborg's theory on dynamic recrystallization. However, high-pressure application considerably retarded recrystallization and grain-growth kinetics. This behaviour was attributed to an increase in the activation energy for grainboundary migration at high pressure.
KeywordsPolymer Microstructure Nickel Migration Activation Energy
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