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Journal of Materials Science

, Volume 27, Issue 20, pp 5653–5660 | Cite as

Wettability of nickel alloys by Ni-Si-B fillers: influence of substrate oxide reduction and isothermal solidification

  • W. F. Gale
  • E. R. Wallach
Papers

Abstract

The process of wetting of nickel and nickel-chromium substrates by nickel-silicon-boron filler metals is examined. In this system, wetting behaviour is dominated by interactions between the filler metal and the oxide layer on the substrate (which is not completely removed during conventional vacuum brazing). Boron emanating from the filler metal reduces this residual oxide. The extent of wettability is controlled by the onset of isothermal solidification which is a consequence of the removal of boron from the filler metal due to the reaction with the substrate oxide layer.

Keywords

Oxide Polymer Nickel Boron Oxide Layer 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Chapman & Hall 1992

Authors and Affiliations

  • W. F. Gale
    • 1
  • E. R. Wallach
    • 1
  1. 1.Department of Materials Science and MetallurgyUniversity of CambridgeUK

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