Journal of Materials Science

, Volume 29, Issue 3, pp 664–668 | Cite as

Fabrication of silicon membrane using fusion bonding and two-step electrochemical etch-stopping

  • B. K. Ju
  • M. H. Oh
  • K. H. Tchah


A new type of silicon membrane structure was fabricated using wafer fusion bonding and two-step electrochemical etch-stopping methods. An “active wafer” of p-type epi/n-type epi/p-type substrate was first elctrochemically etched to form a shallow cavity on the p-type epitaxial layer. Then, the cavity-formed side was fusionally bonded with p-type silicon “working wafer” and, afterwards, the p-type substrate of the active wafer part was removed by a second electrochemical etch-stopping leaving only the n-type membrane on the shallow cavity. Using the new membrane structure in mechanical sensors, more precise control of cavity depth and membrane thickness was achievable and the influence of crystalline imperfections on the sensing circuits located near the bonding seam was avoidable.


Polymer Silicon Membrane Structure Epitaxial Layer Cavity Depth 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Chapman & Hall 1994

Authors and Affiliations

  • B. K. Ju
    • 1
  • M. H. Oh
    • 1
  • K. H. Tchah
    • 2
  1. 1.Division of Electronics and Information TechnologyKorea Institute of Science and TechnologySeoulKorea
  2. 2.Department of Electronics EngineeringKorea University Anam-dongSeoulKorea

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