Effect of grain boundary phase on the thermal conductivity of aluminium nitride ceramics
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AIN with high thermal conductivity was fabricated by pressureless sintering with Y2O3 as the sintering aid. The thermal conductivity was observed to increase with sintering time (up to 8 h) at 1810 °C. The distribution of the sintering aid was identified as one of the major factors influencing the thermal conductivity in AIN. Non-uniform distribution of the grain boundary phase was found to be associated with a significant amount of porosity, resulting in the enhancement of phonon scattering and thereby lowering the thermal conductivity.
KeywordsPolymer Aluminium Porosity Thermal Conductivity Nitride
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- 3.C.-F. Chen, in Proceedings of IEPS 9th Annual International Electronic Package Conference, San Diego, 1989 (The American Ceramic Soc., Westerville, OH) p. 1291.Google Scholar
- 4.M. P. Borom, G. A. Slack and J. W. Szymaszek, Amer. Ceram. Bull. 51 (1972) 852.Google Scholar
- 8.Idem,, Amer. Ceram. Bull. 68 (1989) 883.Google Scholar
- 11.L. Weisenbach, J. A. S. Ikeda and Y.-M. Chiang, in “Ceramic Substrates and Packages for Electronic Applications”, Advances in Ceramics Vol. 26, edited by M. F. Yan, H. M. O'Bryan Jr, K. Niwa and W. S. Young, p. 133.Google Scholar
- 13.C.-F. Chen and E. Savrun, in “Materials and Processes for Microelectronic Systems”, Ceramic Transactions Vol. 15, edited by K. M. Nair, R. Pohanka and R. C. Buchanan (The American Ceramic Soc., Westerville, OH, 1991) p. 193.Google Scholar
- 16.R. E. Taylor, Report PB-225 591 (NTIS, US Department of Commerce, Springfield, VA, 1973).Google Scholar