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Journal of Materials Science

, Volume 29, Issue 9, pp 2406–2416 | Cite as

How the work of adhesion affects the mechanical properties of silica-filled polymer composites

  • S. W. Shang
  • J. W. Williams
  • K. -J. M. Söderholm
Papers

Abstract

An equation correlating work of adhesion (Wa) with Young's modulus and tensile strength of silica-filled polymer composites is derived. It shows that the logarithms of Young's modulus and tensile strength are inversely proportional to Wa. Fourier transform infrared (FT. i.r.) results of the composites show that the silica interphase thickness increases with increased W a h values (the hydrogen bond component of Wa). The logarithmic correlation between interphase thickness and Wa is similar to that found for both Young's modulus and tensile strength. These similarities suggest that Wa can be used to quantify interfacial bonding. Our study further shows that the composite with the lowest Wa value follows the Guth-Smallwood equation for predicting Young's modulus. However, as the interphase layer becomes thicker (increased Wa value), Young's modulus increases more than predicted from the Guth-Smallwood equation. Thus, an extension of the Guth-Smallwood equation is introduced to account for the effect of Wa on the Young's modulus value.

Keywords

Hydrogen Polymer Mechanical Property Fourier Hydrogen Bond 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Chapman & Hall 1994

Authors and Affiliations

  • S. W. Shang
    • 1
  • J. W. Williams
    • 1
  • K. -J. M. Söderholm
    • 1
    • 2
  1. 1.Departments of Materials Science and EngineeringUniversity of FloridaGainesvilleUSA
  2. 2.Department of Dental BiomaterialsUniversity of FloridaGainesvilleUSA

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