Journal of Materials Science

, Volume 30, Issue 5, pp 1295–1301 | Cite as

Liquid phase bonding of yttria stabilized zirconia with CaO-TiO2-SiO2 glass

  • Bi-Shiou Chiou
  • Chung-Daw Young
  • Jenq-Gong Duh


A 36.8 wt% CaO-26.2wt% TiO2-37.0 wt % SiO2 glass (CTS) was employed as the ceramic brazer for the bonding of 3 mol% yttria stabilized zirconia (YSZ3). Sandwich-like YSZ3-CTS-YSZ3 specimens were fabricated and temperature dependence of the bonding strength was evaluated. An optimum bonding process was achieved at a bonding temperature of 1424 °C for 30min with CTS glass slurry having a glass/organic ratio of 1.82. The effects of processing parameters on the bending was investigated on the basis of the metallurgical evolution at the interface. In addition, predominating factors affecting the bonding strength were also explored.


Polymer SiO2 Zirconia Liquid Phase Bonding Strength 
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  1. 1.
    C. D. Qin, N. A. James and B. Derby, Acta Metall. Mater. 40 (1992) 925.CrossRefGoogle Scholar
  2. 2.
    C. D. Qin and B. Derby, J. Mater. Res. 7 (1992) 1480.CrossRefGoogle Scholar
  3. 3.
    J. G. Duh, W. S. Chien and B. S. Chiou, J. Mater. Sci. Lett. 8 (1989) 405.CrossRefGoogle Scholar
  4. 4.
    J.G. Duh, Y.C. Wu and B. S. Chiou, J. Mater. Sci. 25 (1990) 2626.CrossRefGoogle Scholar
  5. 5.
    Y. Yoshino, J. Am. Ceram. Soc. 72 (1989) 1322.CrossRefGoogle Scholar
  6. 6.
    X. M. Xue, Z. T. Sui and J. T. Wang, J. Mater. Sci. Lett. 11 (1992) 1514.CrossRefGoogle Scholar
  7. 7.
    R. E. Loehman and A. P. Tomsia, Acta Metall. Mater. 40 (1992) S75.CrossRefGoogle Scholar
  8. 8.
    N. Iwamoto and H. Yokoo, J. Mater. Sci. 27 (1992) 441.CrossRefGoogle Scholar
  9. 9.
    R. C. Rathner and D. J. Green, J. Am. Ceram. Soc. 73 (1990) 1103.CrossRefGoogle Scholar
  10. 10.
    N. Iwamoto and H. Yokoo, Engineering Fracture Mechanics 40 (1991) 931.CrossRefGoogle Scholar
  11. 11.
    T. Nagano, H. Kato and F. Wakai, J. Mater. Sci. 26 (1991) 4985.CrossRefGoogle Scholar
  12. 12.
    S. Baik, J. Am. Ceram. Soc. 70 (1987) c105.Google Scholar
  13. 13.
    P. F. Becheer and S. A. Halen, Ceram. Bull. 58 (1979) 582.Google Scholar
  14. 14.
    S. L. Swurtzz, B. S. Majumder, A. Skidmore and B. C. Mutssuddy, Mater. Lett. 7 (1989) 407.CrossRefGoogle Scholar
  15. 15.
    W. A. Zdaniewski, P. M. Shah and H. P. Kirchner, Adv. Ceram. Mater. 2 (1987) 204.CrossRefGoogle Scholar
  16. 16.
    M. L. Mecartney and R. Sinclair, J. Am. Ceram. Soc. 68 (1985) 472.CrossRefGoogle Scholar
  17. 17.
    S. M. Johnson and D. J. Rowcliffe, ibid. 68 (1985) 468.CrossRefGoogle Scholar
  18. 18.
    R. C. Devriess, R. Roy and E. F. Qsborn, ibid. 38 (1955) 158.CrossRefGoogle Scholar
  19. 19.
    J. G. Duh, H. T. Dai and B. S. Chiou, ibid. 71 (1988) 813.CrossRefGoogle Scholar
  20. 20.
    TSK Ceramics Technical Bulletin, Toyo Soda Manufacturing Co. Ltd, No. Z-112 (1986).Google Scholar
  21. 21.
    F. F. Lange, J. Mater. Sci. 17 (1982) 225.CrossRefGoogle Scholar
  22. 22.
    N. Claussen and M. Ruhle, in “Advances in Ceramics, Vol. 3”, edited by A. H. Heuer (The American Ceramic Society, Columbus, OH, 1988) pp. 137–152.Google Scholar
  23. 23.
    R. H. J. Hannink, K. A. Johnson, R. T. Pascoe and R. C. Garvie, “ 1988) pp. 116–136.Google Scholar
  24. 24.
    D. C. Agrawal, R. Gopalakrishnan and D. Chakravorty, J. Am. Ceram. Soc. 72 [6] (1989) 912.CrossRefGoogle Scholar
  25. 25.
    R. C. Weast and M. J. Astle, editors “CRC Handbook of Chemistry and Physics” (CRC, Florida, 1980) pp. F216-F217.Google Scholar
  26. 26.
    P. Ramaswamy and D. C. Agrawal, J. Mater. Sci. 22 (1987) 1243.CrossRefGoogle Scholar
  27. 27.
    D. C. Agrawal, R. Gopalakrishnan and D. Chakravorty, J. Am. Ceram. Soc. 72 (1989) 912.CrossRefGoogle Scholar

Copyright information

© Chapman & Hall 1995

Authors and Affiliations

  • Bi-Shiou Chiou
    • 1
  • Chung-Daw Young
    • 2
  • Jenq-Gong Duh
    • 2
  1. 1.Department of Electronic Engineering and Institute of ElectronicsNational Chiao Tung UniversityHsinchuTaiwan
  2. 2.Department of Materials Science and EngineeringNational Tsing Hua UniversityHsinchuTaiwan

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