Journal of Materials Science

, Volume 30, Issue 7, pp 1879–1883 | Cite as

The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine

  • Kwang-Lung Lin
  • Jieh-Ting Chang


The effect of gelatine addition to the electrodeposition bath on the tin content of the solder deposits was investigated. The results showed that as little as 0.5 gl−1 gelatine greatly enhanced the tin content of the deposits. The maximum tin content achievable for the deposit was approximately equal to the percentage of tin in the deposition bath. A lower current density and a greater metal content of the deposition bath tended to offset the effect of gelatine in promoting tin content of the deposit. Gelatine was found, with the aid of scanning electron microscopy and X-ray diffractometry, strongly to affect the morphology and facet orientation of the deposits.


Polymer Microstructure Microscopy Electron Microscopy Scanning Electron Microscopy 
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Copyright information

© Chapman & Hall 1995

Authors and Affiliations

  • Kwang-Lung Lin
    • 1
  • Jieh-Ting Chang
    • 1
  1. 1.Department of Materials Science and Engineering (29)National Cheng Kung UniversityTainanTaiwan

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