Copper thin films prepared by chemical vapour deposition from copper (II) acetylacetonate
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Copper thin films were prepared by a low-temperature atmospheric pressure chemical vapour deposition method. The raw material was copper (II) acetylacetonate. At a reaction temperature above 220°C, polycrystalline copper films can be obtained by hydrogen reduction of the raw material. The resistivity of the film was close to that for bulk copper.
KeywordsHydrogen Polymer Copper Reaction Temperature Chemical Vapour Deposition
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