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Thermal diffusivity and conductivity of highly filled epoxies as cover materials for microelectronical devices as measured by the heat pulse technique

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Nyilas, A., Rehme, R., Wyrwich, C. et al. Thermal diffusivity and conductivity of highly filled epoxies as cover materials for microelectronical devices as measured by the heat pulse technique. J Mater Sci Lett 15, 1457–1459 (1996). https://doi.org/10.1007/BF00275305

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Keywords

  • Polymer
  • Epoxy
  • Thermal Diffusivity
  • Material Processing
  • Heat Pulse