This paper is concerned with the study of square-wave unipolar pulse and bipolar pulse reverse electroplating and, particularly, the determination of pulse parameters to optimise through-hole plating rates and uniformity in the production of printed circuit boards (PCBs). The Wagner number, derived from cathode polarization behaviour in electroplating solutions, with and without plating additives, and under pulse plating conditions, was used to rationalize the data obtained. Fundamental predictions were found to compare favourably with results obtained from practical plating tests.
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Kalantary, M.R., Gabe, D.R. & Goodenough, M.R. Unipolar and bipolar pulsed current electrodeposition for PCB production. J Appl Electrochem 23, 231–240 (1993). https://doi.org/10.1007/BF00241914
- Print Circuit Board
- Cathode Polarization
- Plating Test
- Polarization Behaviour