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Unipolar and bipolar pulsed current electrodeposition for PCB production

Abstract

This paper is concerned with the study of square-wave unipolar pulse and bipolar pulse reverse electroplating and, particularly, the determination of pulse parameters to optimise through-hole plating rates and uniformity in the production of printed circuit boards (PCBs). The Wagner number, derived from cathode polarization behaviour in electroplating solutions, with and without plating additives, and under pulse plating conditions, was used to rationalize the data obtained. Fundamental predictions were found to compare favourably with results obtained from practical plating tests.

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References

  1. [1]

    J. C. Puippe and F. Leaman, ‘Theory and Practice of Pulse Plating’, AESFS, USA (1986).

  2. [2]

    C. Kasper, J. Electrochem. Soc. 77 (1940) 353

  3. [2a]

    C. Kasper, J. Electrochem. Soc. 77 (1940) ;

  4. [2b]

    C. Kasper, J. Electrochem. Soc. (1940) 131

  5. [2b]

    C. Kasper, J. Electrochem. Soc. (1940) 147;

  6. [2c]

    C. Kasper, J. Electrochem. Soc. (1942) 153.

  7. [3]

    T. Pearson and J. K. Dennis, J. Appl. Electrochem. 20 (1990) 196.

  8. [4]

    R. C. Alkire and J. B Ju, J. Electrochem. Soc. 134(5) (1987) 1172.

  9. [5]

    D. T. Chin, N. R. K. Vilambi and M. K. Sunkara, Plating & Surf. Finish. 76 (1989) 74.

  10. [6]

    A. Montgomery, Circuit World 15(2) (1989) 33.

  11. [7]

    J. C. T. Controls Ltd, Dorset, UK, Optimization Trials on 3.2 mm Test Boards (unpublished data).

  12. [8]

    C. Wagner, J. Electrochem. Soc. 98 (1951) 116;

  13. [8a]

    Plating 48 (1961) 977;

  14. [8b]

    Adv. Electrochem. Eng. 2 (1962) 1.

  15. [9]

    M. R. Kalantary, ‘Pulse Electroplating of Copper for Printed Circuit Board Technology’. Ph.D. Thesis, Loughborough University of Technology (November 1990).

  16. [10]

    M. R. Kalantary, D. R. Gabe and M. Goodenough, Met. Finish. (USA) 89(4) (1991) 21.

  17. [11]

    M. Goodenough and K. J. Whitlaw, Trans. I.M.F. 67 (1989) 57.

  18. [12]

    D. A. Uceda and J. O'Keefe, J. Appl. Electrochem. 20 (1990) 327.

  19. [13]

    R. Haak, C. Ogden and D. Tench, ibid. 11 (1981) 771.

  20. [14]

    A. J. Bard and L. R. Faulkner, ‘Electrochemical Methods-Fundamental Applications’, Wiley, New York (1980).

  21. [15]

    N. Ibl, IUPAC Information Bulletin 59 (1977).

  22. [16]

    K. E. Yung, L. T. Romankiw and R. C. Alkire, ‘Electrodeposition Technology, Theory and Practice’ (edited by L. T. Romankiw and D. R. Turner), Electrochem. Soc. Proc. 87-17 (1987) 75.

  23. [17]

    R. C. Alkire and A. A. Mirarefi, J. Electrochem. Soc. 120 (1973) 1507.

  24. [18]

    H. K. Ng, A. C. C. Tseung and D. B. Hibbert, ibid. 127 (1980) 1034.

  25. [19]

    A. M. Pesco and H. Y. Cheh, ibid. 131 (1984) 2259.

  26. [20]

    N. Ibl and M. Braun, Chem.-Ing.-Tech. 45(4) (1973) 182.

  27. [21]

    CR Circuit, Trans. I.M.F., Bulletin (August 1989) 4.

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Kalantary, M.R., Gabe, D.R. & Goodenough, M.R. Unipolar and bipolar pulsed current electrodeposition for PCB production. J Appl Electrochem 23, 231–240 (1993). https://doi.org/10.1007/BF00241914

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Keywords

  • PCBs
  • Print Circuit Board
  • Cathode Polarization
  • Plating Test
  • Polarization Behaviour