Prototype analysis of gravity-modulated welding by inverting weld cross sections K. P. CooperS. G. LambrakosH. N. Jones III Research Summary Pages: 21 - 26
Weld analysis using an inverse-problem approach based on quasi-one-dimensional interpolation S. G. LambrakosJ. O. MilewskiP. G. Moore Research Summary Pages: 27 - 36
Submicron particle chemistry: Vapor condensation analogous to liquid solidification Neil T. JenkinsThomas W. Eagar Overview Pages: 44 - 47
Lead-free solders and processing issues in microelectronics Raymond A. Fournelle Commentary Pages: 49 - 49
The compression stress-strain behavior of Sn-Ag-Cu solder Paul T. ViancoJerome A. RejentJoseph J. Martin Research Summary Pages: 50 - 55
The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder F. OchoaJ. J. WilliamsN. Chawla Research Summary Pages: 56 - 60
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu Sung K. KangDa-Yuan ShihWon Kyoung Choi Search Summary Pages: 61 - 65
Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation R. R. ChromikR. P. VinciM. R. Notis Research Summary Pages: 66 - 69
Complying with the statutory written description requirement in a U.S. utility patent application Arnold B. Silverman End Notes Pages: 80 - 80