The hot deformation of aluminum alloys Thomas R. BielerLawrence A. LalliStuart R. MacEwen Commentary Pages: 14 - 15
Metal forming at the center of excellence for the synthesis and processing of advanced materials D. A. HughesM. E. KassnerJ. S. Vetrano Overview Pages: 16 - 21
Modeling the recrystallization textures of aluminum alloys after hot deformation O. EnglerH. E. Vatne Overview Pages: 23 - 27
The processing, properties, and applications of high-strain-rate superplastic materials Mamoru MabuchiKenji Higashi Overview Pages: 34 - 39
Using intense plastic straining for high-strain-rate superplasticity Terence G. LangdonMinoru FurukawaMinoru Nemoto Research Summary Pages: 41 - 45
Advances in thermal management materials for electronic applications Sungho Jin Commentary Pages: 46 - 46
Advances in composite materials for thermal management in electronic packaging Carl Zweben Overview Pages: 47 - 51
Sintered aluminum nitride ceramics for high-power electronic applications Jonathan H. Harris Overview Pages: 56 - 60
Designing low-thermal-expansivity, high-conductivity alloys in the Cu-Fe-Ni ternary system R. D. CottleX. ChenM. E. Fine Overview Pages: 67 - 69
Low-thermal-expansion copper composites via negative CTE metallic elements S. JinH. Mavoori Design Pages: 70 - 72
Presenting your technical paper may have an impact on intellectual property rights Arnold B. Silverman Material Matters Pages: 73 - 73