Current developments in electronic packaging materials Judith Glazer Interconnection and Electronic Material Pages: 7 - 7
Interconnection technologies and materials science W. L. WinterbottomS. K. Kang Interconnection and Electronic Material Pages: 8 - 9
An issue in thermal management: Metallizing high thermal conductivity ceramic substrates in microelectronics Alistair D. WestwoodMichael R. Notis Interconnection and Electronic Material Pages: 10 - 15
Damage integral analysis of solder joint fatigue John McGroartyRavi SubrahmanyanChe-Yu Li Interconnection and Electronic Material Pages: 16 - 20
The effect of pretinning on the solderability of copper A. J. SunwooH. HayashigataniG. K. Lucey Jr. Interconnection and Electronic Material Pages: 21 - 24
Thin films, thick films and multichip modules Joseph A. Castrovilla Interconnection and Electronic Material Pages: 25 - 25
The recycling of hazardous metal plating wastes Robert R. OdleIsidro MartinezLee A. Deets Recycling Metal Waste Pages: 28 - 31
The recovery of metal values from process residues C. R. Edwards Recycling Metal Waste Pages: 32 - 33
The electrochemical recovery of nickel from plating residues P. RamachandranK. V. VenkateswaranS. Visvanathan Recycling Metal Waste Pages: 34 - 36
Recovering gallium from residual bayer process liquor Maria Elizabeth Afonso de MagalhãesMatthieu Tubino Recycling Metal Waste Pages: 37 - 39
Considering what constitutes prior art in the United States Walter J. Blenko Jr. Department Pages: 45 - 45