Abstract
The growing complexity of integrated circuits (IC) and the rapid development in VHSICs require contactless testing methods for logic state analysis and waveform measurements on internal nodes of VLSI chips. Considering the fast evolution of VLSI/VHSIC technologies, a contactless testing method has simultaneously to provide challenging features like high-voltage resolution (mV), high spatial resolution (sub-micrometer), and high time resolution (ps) in a short testing time. In addition to these requirements, it is desired that the method should be applicable to all technologies, e.g., Si as well as GaAs-based ones.
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© 1986 Springer-Verlag Berlin Heidelberg
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Clauberg, R., Seitz, H.K., Blacha, A., Kash, J.A., Beha, H. (1986). High-Speed Integrated Circuit Testing by Time-Resolved Photoemission. In: Källbäck, B., Beneking, H. (eds) High-Speed Electronics. Springer Series in Electronics and Photonics, vol 22. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-82979-6_39
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DOI: https://doi.org/10.1007/978-3-642-82979-6_39
Publisher Name: Springer, Berlin, Heidelberg
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