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Material Aspects of Micro- and Nanoelectromechanical Systems

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Springer Handbook of Nanotechnology

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Abstract

One of the more significant technological achievements during the last 20 years has been the development of MEMS and its new offshoot, NEMS. These developments were made possible by significant advancements in the materials and processing technologies used in the fabrication of MEMS and NEMS devices. While initial developments capitalized on a mature Si infrastructure built for the integrated circuit (IC) industry, recent advances have come about using materials and processes not associated with IC fabrication, a trend that is likely to continue as new application areas emerge.

A well-rounded understanding of MEMS and NEMS technology requires a basic knowledge of the materials used to construct the devices, since material properties often govern device performance and dictate fabrication approaches. An understanding of the materials used in MEMS and NEMS involves an understanding of material systems, since such devices are rarely constructed of a single material but rather a collection of materials working in conjunction with each other to provide critical functions. It is from this perspective that the following chapter is constructed. A preview of the materials selected for inclusion in this chapter is presented in Table 11.1. It should be clear from this table that this chapter is not a summary of all materials used in MEMS and NEMS, as such a work would itself constitute a text of significant size. It does, however, present a selection of some of the more important material systems, and especially those that illustrate the importance of viewing MEMS and NEMS in terms of material systems.

Table 11.1 Distinguishing characteristics and application examples of selected materials for MEMS and NEMS
Full size table

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Abbreviations

AFM:

atomic force microscope

AFM:

atomic force microscopy

CMOS:

complementary metal–oxide–semiconductor

CVD:

chemical vapor deposition

DC:

direct-current

DRIE:

deep reactive ion etching

FET:

field-effect transistor

HF:

hydrofluoric

IC:

integrated circuit

LPCVD:

low-pressure chemical vapor deposition

MEMS:

microelectromechanical system

NEMS:

nanoelectromechanical system

PECVD:

plasma-enhanced chemical vapor deposition

PMMA:

poly(methyl methacrylate)

PZT:

lead zirconate titanate

RF:

radiofrequency

RIE:

reactive-ion etching

SEM:

scanning electron microscope

SEM:

scanning electron microscopy

SOG:

spin-on-glass

SOI:

silicon-on-insulator

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Authors and Affiliations

  1. Department of Electrical Engineering and Computer Science, Case Western Reserve University, 10900 Euclid Avenue, 44106, Cleveland, OH, USA

    Christian A. Zorman & Mehran Mehregany

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  1. Christian A. Zorman
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  2. Mehran Mehregany
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Correspondence to Christian A. Zorman or Mehran Mehregany .

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  1. Ohio State University, Nanoprobe Laboratory for Bio- and Nanotechnology and Biomimetics (NLB2), 201 W. 19th Avenue, 43210-1142, Columbus, OH, USA

    Bharat Bhushan

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Zorman, C.A., Mehregany, M. (2010). Material Aspects of Micro- and Nanoelectromechanical Systems. In: Bhushan, B. (eds) Springer Handbook of Nanotechnology. Springer Handbooks. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-02525-9_11

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