Abstract
The goal of this chapter is to identify the optimal range of pressure and voltage to maximize RCF life of ion-plated nickel–copper–silver on ball bearings. Test data from Chap. 6 suggested that an optimal range exists such that coating depletion, and not surface spallation, is the desired failure mode for an optimal coating process recipe. The trade-offs associated with optimal process parameters include (i) improved coating adhesion using higher-voltage plasma, (ii) reduced film stress with lower-voltage plasma, and (iii) coating contamination from element redistribution. These trade-offs must be considered within the context of a large scale ion-plating process in which say 300 ball bearings are coated within a single process.
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Abbreviations
- C Ar (z, t):
-
Argon concentration
- D Ar :
-
Argon diffusion coefficient
- Y Ar :
-
Argon entrapment defect yield
- \( {\Upsilon}_{A{r}^{+}} \) :
-
Argon-ion energy
- M a :
-
Atomic mass of film material
- k b :
-
Boltzmann constant
- n e :
-
Electron density
- T e :
-
Electron temperature
- ρ :
-
Film density
- σ :
-
Film-stress planar
- a p :
-
Implantation depth
- C I (z, t):
-
Interstitial defect concentration
- D I :
-
Interstitial diffusion coefficient
- f p :
-
Ion flux
- ν :
-
Poisson ratio
- P mTorr :
-
Pressure in milli-Torr
- λ p :
-
Recombination distance for interstitial and vacancies
- C V (z, t):
-
Vacancy defect concentration
- D V :
-
Vacancy diffusion coefficient
- E :
-
Young’s modulus
- AES:
-
Auger electron spectroscopy
- DoE:
-
Design of experiments
- EEDF:
-
Electron energy distribution function
- SEM:
-
Scanning electron microscopy
- SRIM:
-
Stopping range of Ions in matter
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Danyluk, M., Dhingra, A. (2015). Effects of Process Parameters on Film RCF Life. In: Rolling Contact Fatigue in a Vacuum. Springer, Cham. https://doi.org/10.1007/978-3-319-11930-4_7
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DOI: https://doi.org/10.1007/978-3-319-11930-4_7
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