Skip to main content
SpringerLink
Log in

Digital image correlation measurement of resin chemical and thermal shrinkage after gelation

  • Original Paper
  • Published:
Journal of Materials Science Aims and scope Submit manuscript

Abstract

A method for measuring chemical shrinkage and coefficient of thermal expansion during cure and post-gelation is presented based on digital image correlation to record the in situ stress-free strain field in a thermosetting polymer. An independent determination of the resin cure kinetics was required to relate the chemical shrinkage strain and coefficient of thermal expansion to the degree of cure. The changes in the coefficient of thermal expansion were observed from the initial heating to final cooling of the sample. The results obtained are shown to compare favorably with results previously found by other techniques. The proposed method provides a simple and reliable procedure to measure the evolution of thermo-chemical shrinkage properties of the resin during the cure cycle.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16

Similar content being viewed by others

References

  1. Madhukar MS, Genidy MS, Russell JD (2000) A new method to reduce cure-induced stresses in thermoset polymer composites, Part I: test method. J Compos Mater 34:1882–1904

    Article  Google Scholar 

  2. Kravchenko OG, Li C, Strachan A, Kravchenko SG, Pipes RB (2014) Prediction of the chemical and thermal shrinkage in a thermoset polymer. Compos A Appl Sci Manuf 66:35–43

    Article  Google Scholar 

  3. Snow AW, Armistead JP (1994) A simple dilatometer for thermoset cure shrinkage and thermal expansion measurements. J Appl Polym Sci 52:401–411

    Article  Google Scholar 

  4. Zarrelli M, Skordos AA, Partridge IK (2002) Investigation of cure induced shrinkage in unreinforced epoxy resin. Plast Rubber Compos 31:377–384

    Article  Google Scholar 

  5. Nawab Y, Casari P, Boyard N, Jacquemin F (2013) Characterization of the cure shrinkage, reaction kinetics, bulk modulus and thermal conductivity of thermoset resin from a single experiment. J Mater Sci 48:2394–2403. doi:10.1007/s10853-012-7026-6

    Article  Google Scholar 

  6. Li C, Potter K, Wisnom MR, Stringer G (2004) In-situ measurement of chemical shrinkage of MY750 epoxy resin by a novel gravimetric method. Compos Sci Technol 64:55–64

    Article  Google Scholar 

  7. Daniel IM, Wang T-M, Karalekas D, Gotro JT (1990) Determination of chemical cure shrinkage in composite laminates. J Compos Technol Res 12:172–176

    Article  Google Scholar 

  8. Hoa SV, Ouellette P, Ngo TD (2009) Determination of shrinkage and modulus development of thermosetting resins. J Compos Mater 43:783–803

    Article  Google Scholar 

  9. Lange J, Toll S, Månson J-AE, Hult A (1995) Residual stress build-up in thermoset films cured above their ultimate glass transition temperature. Polymer 36:3135–3141

    Article  Google Scholar 

  10. Bucknall CB, Partridge IK, Phillips MJ (1991) Mechanism of shrinkage control in polyester resins containing low-profile additives. Polymer 32:636–640

    Article  Google Scholar 

  11. Garstka T, Ersoy N, Potter KD, Wisnom MR (2007) In situ measurements of through-the-thickness strains during processing of AS4/8552 composite. Compos A Appl Sci Manuf 38:2517–2526

    Article  Google Scholar 

  12. Khoun L, Hubert P (2010) Cure shrinkage characterization of an epoxy resin system by two in situ measurement methods. Polym Compos 31:1603–1610

    Article  Google Scholar 

  13. Nawab Y, Shahid S, Boyard N, Jacquemin F (2013) Chemical shrinkage characterization techniques for thermoset resins and associated composites. J Mater Sci 48:5387–5409. doi:10.1007/s10853-013-7333-6

    Article  Google Scholar 

  14. Sutton M, Wolters W, Peters W, Ranson W, McNeill S (1983) Determination of displacements using an improved digital correlation method. Image Vis Comput 1:133–139

    Article  Google Scholar 

  15. Taher ST, Thomsen OT, Dulieu-Barton JM, Zhang S (2012) Determination of mechanical properties of PVC foam using a modified Arcan fixture. Compos A Appl Sci Manuf 43:1698–1708

    Article  Google Scholar 

  16. Diaz JA, Wu X, Martini A, Youngblood JP, Moon RJ (2013) Thermal expansion of self-organized and shear-oriented cellulose nanocrystal films. Biomacromolecules 14:2900–2908

    Article  Google Scholar 

  17. CYCOM 5320-1 Epoxy Resin System

  18. Simon SL, Mckenna GB, Sindt O (2000) Modeling the evolution of the dynamic mechanical properties of a commercial epoxy during cure after gelation. J Appl Polym Sci 76:495–508

    Article  Google Scholar 

  19. Karkanas PI, Partridge IK (2000) Cure modeling and monitoring of epoxy/amine resin systems. I. Cure kinetics modeling. J Appl Polym Sci 77:1419–1431

    Article  Google Scholar 

  20. E37 Committee (2014) Test method for assignment of the glass transition temperatures by differential scanning calorimetry. ASTM International, West Conshohocken, PA. http://www.astm.org/

  21. Nielsen LE (1969) Cross-linking–effect on physical properties of polymers. J Macromol Sci C 3:69–103

    Article  Google Scholar 

  22. Li C, Medvedev GA, Lee E-W, Kim J, Caruthers JM, Strachan A (2012) Molecular dynamics simulations and experimental studies of the thermomechanical response of an epoxy thermoset polymer. Polymer 53:4222–4230

    Article  Google Scholar 

  23. Kasapis S, Al-Marhoobi IM, Mitchell JR (2003) Testing the validity of comparisons between the rheological and the calorimetric glass transition temperatures. Carbohydr Res 338:787–794

    Article  Google Scholar 

  24. Deszczynski M, Kasapis S, MacNaughton W, Mitchell JR (2002) High sugar/polysaccharide glasses: resolving the role of water molecules in structure formation. Int J Biol Macromol 30:279–282

    Article  Google Scholar 

Download references

Acknowledgements

The authors acknowledge Cytec Engineered Materials for providing the materials used in this work. Also, the authors thank LaVision inc. for supplying the speckle pattern, as well as Prof. T. Siegmund and Y. Chen for providing access to DIC software.

Conflict of interest

The authors declare that they have no conflict of interest.

Author information

Authors and Affiliations

  1. School of Aerospace Engineering, Purdue University, 701 W. Stadium Ave., Armstrong Hall of Engineering, West Lafayette, IN, 47907, USA

    Oleksandr G. Kravchenko & Segii G. Kravchenko

  2. School of Materials Engineering, Purdue University, 701 W. Stadium Ave., Armstrong Hall of Engineering, West Lafayette, IN, 47907, USA

    Aaron Casares

  3. School of Aeronautics and Astronautics, Schools of Materials Engineering and Chemical Engineering, Purdue University, 701 W. Stadium Ave., Armstrong Hall of Engineering, West Lafayette, IN, 47907, USA

    R. Byron Pipes

Authors
  1. Oleksandr G. Kravchenko
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Segii G. Kravchenko
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Aaron Casares
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. R. Byron Pipes
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Oleksandr G. Kravchenko.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Kravchenko, O.G., Kravchenko, S.G., Casares, A. et al. Digital image correlation measurement of resin chemical and thermal shrinkage after gelation. J Mater Sci 50, 5244–5252 (2015). https://doi.org/10.1007/s10853-015-9072-3

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10853-015-9072-3

Keywords

Search

Navigation